TOKYO-Hitachi Ltd., Intel Corp., Mitsubishi Electric Corp. and Sharp Corp. agreed to standardize specifications for stacked chip scale packages, a multiple memory module for mobile communications and handheld computing applications.
Specifications of S-CSP with flash memory and SRAM chips include compatibility of pin assign, unification of ball layout and ball pitch and unification of package size.
Sharp and Mitsubishi first proposed standardized specifications for S-CSP in September 1998.
Five additional companies, including both semiconductor manufacturers and semiconductor assembly manufacturers, will support the unified specifications, said the companies. Those companies were not named.
