SAN DIEGO-Qualcomm Inc. reported that 15 handset manufacturers from around the world have shown support for the company’s third-generation Code Division Multiple Access 1x Multi-Carrier MSM5000 Mobile Station Modem chipset and system software solution.
The chipset and software are designed to allow manufacturers to roll out 1x handsets that, in addition to offering application and feature sets in small form factors, will provide extended standby times as well as higher voice capacity and data rates.
Handset manufacturers began receiving the new chipset from Qualcomm in January and expect deployment of commercial 1x systems using the chipset by then end of the year.
Qualcomm also announced industry acceptance of its Removable User Identity Module using its MSM chipset and software targeted for the deployment of R-UIM in countries such as China and Korea.
Qualcomm noted the solution paves the way for R-UIM-based smart card services in CDMA handsets to complement the current offerings of CDMA voice and data services.
