BARCELONA, Spain-InterDigital Communications Corp. announced plans to make third-generation technology and product design easier and faster using its system-on-a-chip solution to test both software and hardware as though they were operating within a full system in a real environment.
“As changes are required, because of evolving standards or customer changes to the technical requirements of the wireless product, our developers can modify designs in a simulated environment to test effects on traffic, spectral efficiency and load,” said John Kaewell, senior vice president of advanced product development at InterDigital. “Only when it is completely proven, does the design take shape as an [application specific integrated circuit] manufactured by a chip producer.”