MUNICH, Germany-Infineon Technologies AG and InterDigital Communications Corp. announced a long-term partnership to develop enabling software for third-generation mobile products.
The software they create will be incorporated into Infineon’s standard 3G System-on-a-Chip Integrated Circuits for mobile terminals. In addition, InterDigital will design and sell custom ASICs, produced by Infineon, to the infrastructure and specialized terminal markets.
The software will be marketed and licensed as part of Infineon’s total system solution offering for UMTS/GPRS dual-mode products and as a stand-alone product to 3G equipment producers.
