BEIJING—Philips Semiconductor and China’s Huawei Technologies have agreed to jointly develop application specific integrated circuits (ASICs) for 3G products.
Philips Semiconductor will mainly provide technical support and manufacturing services. The company will provide Huawei with 0.18 micron ASICs.
Both companies are also considering cooperating in the fields of System on a Chip (SoC), digital signal processing (DSP) and special Internet Protocol (IP) modules.
