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TelASIC completes initial funding round

EL SEGUNDO, Calif.—TelASIC Communications announced it has completed a $22.5 million initial round of financing.

The semiconductor company plans to develop cost-effective RF and analog mixed signal solutions for advanced wireless applications.

“I decided to lead this company because of the leading-edge product capability, experienced design team, and the unique intellectual property developed by Raytheon,” said Tony Giraudo, chief executive officer of TelASIC Communications, who has 20 years of experience in the semiconductor industry.

TelASIC was founded through a partnership between Raytheon Co. and Milcom Technologies, and this round of funding was led by ComVentures.

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