TOKYO-Under an agreement announced Feb. 13, M-Systems and Toshiba America Electronics Components are jointly developing and marketing the Mobile DiskOnChip G3, which they said, “breaks the world record for capacity and size.”
Engineering samples of the 512 Mbit version of G3 flash disk will be available during the second quarter, and mass production is scheduled for the third quarter.
“Mobile DiskOnChip G3 provides the density, performance and low-power requirements to meet the increasing memory needs of mobile devices,” said Stephen Marlow, executive vice president of Toshiba America Electronics Components.
