Intel Corp. has joined with other players to extend the scope of an alliance to accommodate wireless communications for next-generation applications.
The group, known as the Innovation Alliance, includes such companies as ASUSTeK, Compal, Gigabyte, HTC, MicrosStar, Mitac, SuperMicro, Quanta and Wistron.
Intel will provide the members with the architecture for the design and manufacturing of new converged products.
“Through the Innovation Alliance, Intel provides members with Platform Vision guides containing platform definitions, usage models and market trends, and customized support .” said Intel.
The company said it is major step to meet consumer demand for rich data applications, multi-tasking functions, longer battery life and small form factors.
“The Innovation Alliance is an integral part of Intel’s ongoing efforts to develop, enable and empower the enterprise ecosystem to ultimately bring increasing value to end users,” said Abhijit Talwalkar, vice president and general manager of Intel’s enterprise platform group.
Intel also unveiled its memory system called StrataFlash for storage of camera images, audio and video files for next-generation handsets.
It is based on the company’s Multi-level Cell technology, which contains three types of memory functionality, including code execution, data storage and RAM working space.
“The system also features 1.8-volt operation for longer battery life and memory densities up to 1 GB. It comes in one tiny package that simplifies the design process for wireless handset makers,” said Intel.
