DALLAS-In what both companies see as a signal of future collaboration, Sun Microsystems Inc. and Texas Instruments Inc. are working together to deliver optimized end-to-end wireless solutions for 2.5- and third-generation networks.
In the deal, TI licensed Sun’s Connected Limited Device Configuration HotSpot Implementation for integration to its GSM/GPRS chipsets for handsets and its OMAP processors. This will reduce the complexity of Java-enabled handset production and will be available in the second quarter of next year, said both companies.
The deal will integrate CDMA, EDGE and UMTS protocols in the future, according to the companies.
