FREMONT, Calif.-Singapore’s ST Assembly Test Services Ltd. and ChipPac Inc. have agreed to merge, creating what it calls one of the world’s premier test and assembly solution providers for semiconductors.
The companies have tested and packaged chips for bellwethers like Intel Corp and Analog Devices Inc.
The combined company expects to have more than $1 billion in revenue this year and expects its customers to span countries including China, Korea, Malaysia, Singapore, Taiwan and the United States.
“The merger will enable the combined company to be a global player who can provide fully integrated, multi-site, unparalleled, end-to-end assembly and testing solutions,” said Tan Lay Koon, president and chief executive of STATS.
In other chip announcements, Intel Corp. said it unveiled software that will simplify application development for wireless and desktop platforms.
The software, known as IPP 4.0, allows developers to run the tools and view results within the Microsoft Visual Studio.NET Development Environment.
“Intel IPP and Intel Threading Tools are designed to help developers maximize the benefits of Intel’s latest processors enabling developers to focus their efforts on delivering new features for their applications,” said Jon Khazam, general manager of Intel’s Software products division.
Texas Instruments also unveiled a camera processor that will allow wireless users to connect to such short-range technologies as 802.11 and ultra wideband.
“It has the hardware in the processor to connect to a wireless device,’ said Kanika Ferrell, spokeswoman for TI.
