MUNICH, German-The MultiBand OFDM Alliance Special Interest Group said it completed its physical layer 1.0 specifications, which will be made available to its promoter, contributor and adopter members.
The specifications will allow companies to finalize their standards-based ultra-wideband chip and board-level designs, said the group.
“This achievement by the MBOA-SIG is the result of over 100 engineers from more than 50 companies working together to create these specs. Altogether, more than 200,000 engineer man hours and an unrelenting peer review process have yielded a rock-solid specification,” said Stephen Wood, strategic marketing manager with Intel’s research and development division and a member of the MBOA-SIG steering committee. “We are proceeding rapidly to ensure interoperable consumer products in mass production.”<
