TOKYO-TTPCom Communications and NEC Electronics Corp. said they are joining forces to develop dual-mode chips for second- and third generation technologies.
The new product will combine TTPCom’s EDGE/GPRS/GSM silicon and software architecture with NEC’s wideband-CDMA baseband chips.
The companies believe that the product will “address the growing world market for dual-mode wireless products that can handover to EDGE/GPRS/GSM networks outside pockets of 3G coverage.”
