KING OF PRUSSIA, Pa.-InterDigital Communications Corp. signed an agreement with the semiconductor division of Royal Philips Electronics Ltd. to include InterDigital’s High-Speed Downlink Packet Access technology in the Nexperia cellular system solutions line.
InterDigital offers its HSDPA solution as a set of technology blocks for incorporation into existing UMTS Release 99/Release 4 chips or as a separate co-processor chip for initial deployment.
Through its Nexperia Partner Program, Philips brings intellectual property or software from third parties into its semiconductor system solutions.
