SAN DIEGO-Qualcomm Inc. launched two next-generation wireless platforms-DO Multi-carrier Multi-link eXtensions and HSDPA Multi-carrier Multi-link eXtensions. The company said the DMMX and HMMX platforms support the roadmaps of CDMA2000 1x EV-DO and HSDPA technologies into the year 2010.
Qualcomm said the DMMX and HMMX platforms are designed to significantly improve the performance of third-generation CDMA technology and will also allow operators to deploy networks and devices that combine technologies optimized for specific services. In addition, Qualcomm said the platforms will lower costs and boost performance for operators as they launch new services for their customers.
“Consumers may not care about the technologies underlying the amazing new services they want on their phones, but to deliver these services profitably, the wireless operator does,” said Paul Jacobs, chief executive of Qualcomm. “Qualcomm’s DMMX and HMMX platforms encompass an array of advancements being made in CDMA and a broad range of other wireless technologies, enabling operators to expand their service offerings to support consumer desires while improving their business models.”
“The defining of these platforms reinforces our Convergence Platform strategy of enabling consumer electronics features on mobile handsets,” said Sanjay Jha, president of CDMA Technologies at Qualcomm. “Qualcomm is developing products that we expect to announce in 2006 that take full advantage of the unsurpassed data throughput, multicast and capacity benefits offered by DMMX and HMMX that will take us well into the next decade.”
Qualcomm explained that in DMMX and HMMX, “multi-carrier multi-link” represents the use of multiple wireless transmission protocols in multiple frequency bands-simultaneously. The term “multi-carrier” also represents enhancements described in the latest version of the EV-DO standard, Revision B, which allows data to flow over more than one channel at the same time, thus increasing peak data rates.
In other Qualcomm news, the company said it achieved HSDPA data rates of 3.6 megabits per second with infrastructure vendors, bringing the high-speed technology closer to commercialization. The company said its Mobile Station Modem chips were used during the testing.
“We have gone from sampling the MSM6280 chipset to achieving 3.6 megabits per second calls in interoperability testing with infrastructure vendors in less than two months, and anticipate reaching data rates of 7.2 megabits per second in the near future,” said Luis Pineda, senior vice president of marketing and product management for CDMA Technologies at Qualcomm.