PISCATAWAY, N.J.-The Mobile Industry Processor Interface Alliance released two new specifications to accelerate the development of camera phones.
The specifications include a physical layer, D-PHY, which is designed to act as a re-usable platform for MIPI camera interfaces, display panel interfaces and general-purpose high-speed/low-power interfaces. D-PHY, which delivers up to 1 Gbps per lane via an advanced source-synchronous, differential SLVS design, is based on 1.2V supplies.
The group also introduced Camera Serial Interface 2, a scalable, low-power, high-bandwidth interface between camera sensors and host processors typically found in camera phones. The specification, which can scale as high as 4 Gbps, is designed to enable new camera features, add flexibility to phone architectures and support sensor resolutions beyond 10 megapixels.
The industry association boasts more than 90 member companies including Freescale Semiconductor, Motorola Inc., Nokia Corp., Philips and Samsung Electronics Co. Ltd. MIPI specifications are available only to members of the alliance.
“Literally tens of thousands of hours invested by member company participants are now beginning to yield dividends to the industry,” said Tom Vial, chairman of the board of MIPI Alliance. “The entire organization is excited about the impact we expect to make in 2006.”
