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On the showfloor at the Common Platform Technology Forum in Santa Clara on Tuesday, RCR managed to track down Simon Segars, executive VP and general manager of ARM’s physical IP division to talk us through the ins and outs of chip IP and design.
ARM, which has just renewed its collaboration with the IBM alliance to work on IP for chips as tiny as 14nm, believes that manufacturing collaboration ensures greater efficiency and lower costs, which means its partners can manufacture many more mobile chips.
We talked to Simon about the delicate balance between high performance chips with the lowest possible power, and just how difficult this was to achieve.
Watch the interview below:
