Samsung Electronics announced late last week that it has started producing embedded multi-chip package memory for use in entry-to mid-level smartphones.
Samsung’s new eMCP solutions come in range of densities, utilizing low power double-data-rate 2 DRAM made with 30 nanometer class process technology and NAND flash memory using 20nm-class technology.
“Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012,” said Myungho Kim, VP of memory marketing and device solutions at Samsung.
Samsung said the memory solutions is designed to help entry- to mid-level smartphones deliver “enhanced performance and longer battery life, while providing mobile handset developers with a simpler design process.”
