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Siemens, Huawei form joint venture for TD-SCDMA

BEIJING-Siemens AG and Huawei Technologies Co. Ltd. said they have signed a contract to form a joint venture for the third-generation mobile standard known as TD-SCDMA.

The deal, which will draw a combined $100 million from both companies, will allow them to develop, manufacture and market the technology. Siemens will provide 200 employees, while Huawei will give 100. The headquarters will be in Beijing.

Siemens has been working on the protocol since 1998 and invested more than $180 million in its efforts.

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