WOODBURY, N.Y.-Comverse and Texas Instruments Inc. announced Comverse’s enhanced messaging services will operate on TI’s OMAP platform for 2.5 and 3G wireless devices.
By combining Comverse’s platform with TI’s OMAP processors, device manufacturers and operators can reduce deployment time of applications including mobile e-mail, multimedia messaging, instant messaging and mobile entertainment services.
The companies plan to showcase mobile multimedia e-mail together at 3GSM World Congress in Cannes in mid-February.
