SAN DIEGO—Qualcomm Inc. said it rolled out the first samples of its third-generation Mobile Station Modem, or MSM6050, which it claims to be the first baseband integrated circuit on 300mm wafers.
The company produced the device in collaboration with the Taiwan Semiconductor Manufacturing Company Ltd.
The MSM6050 will offer increased processing power in a mid-tier 3G solution that doubles system voice capacity over previous IS-95 A/B solutions, supports data rates of up to 153 kilobits per second, and integrates Qualcomm CDMA Technologies’ radioOne Zero Intermediate Frequency, or direct conversion, architecture, according to the company.
