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TOKYO-Oki Electric Industry Co. Ltd. and ST Assembly Test Services developed an RF chip package and production test solution with Bluetooth specifications for the wireless market. “This Bluetooth device uses the [complementary metal oxide semiconductor radio frequency] process, which can be commercially produced at a competitive price,” said Kaoru Saito, general manager of the advanced products department at Oki Electric. “We believe this breakthrough brings Bluetooth technology one step closer to Internet appliances in the 3G wireless world.”
