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TI, ARM TO DEVELOP PLATFORM FOR DEVICES

DALLAS-Texas Instruments Inc. and ARM Ltd. last week announced plans to collaborate on developing a digital signal processor and microcontroller platform for use in next-generation wireless information devices, including smart phones, personal communicators and wireless Internet-enabled products.

TI and ARM have worked together since 1993 on wireless platforms.

The new Dual-Core platform planned by the companies will be based on TI’s DSP technology and ARM’s advanced 32-bit RISC microcontroller core. The platform will be optimized to run current and future wireless applications such as 2.5- and third-generation applications, said the companies.

The platform will offer increased performance with low power consumption capable of running real-time audio and video applications on wireless devices.

Bob Carl, director of marketing for the Americas for TI’s wireless business unit, said TI’s efforts with ARM will provide a road map for its customers as they move toward next-generation deployments.

In a separate deal, TI licensed the ARM10 processor family to extend the performance and capabilities of its existing DSP and microcontroller platform for second-generation wireless applications.

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