Chips – Semiconductor

NEW YORK-Moody’s Investors Service Inc. is reviewing $400 million in Hyundai Semiconductor America debt for possible downgrade because merger talks between HSA and LG Semicon Co. Ltd. hit an impasse …

The State Department late last month urged the European Commission to allow U.S. third-generation wireless equipment and service providers a fair opportunity to compete in Europe. In a letter sent …

OXFORD, United Kingdom-Iridium L.L.C. launched its global mobile satellite service last November, and demand for the service reportedly is high, but so far largely unfulfilled. Shortage of handsets is being …

The International Telecommunication Union’s 31 December deadline passed without resolution in the intellectual-property-right stand-off over third-generation technology, but the ITU has indicated it may push ahead anyway. The ITU warned …

COPENHAGEN, Denmark-Reaching agreement on a single work item within a standards organization can be a long and laborious process. Reaching an agreement between five standards organizations across the world is …

The semiconductor industry is showing signs it could be emerging from a slump that has plagued it this year. The Asian economic crisis, coupled with a glut of semiconductor products …

L.M. Ericsson’s offer to compromise on third-generation technology may not change the International Telecommunication Union’s action on Dec. 31. The ITU is likely to halt any work on Code Division …

Palm Computing Inc., an affiliate of 3Com Corp., introduced the Palm VII personal digital assistant at the Palm Computing Platform Worldwide Developer Conference in Santa Clara, Calif., featuring out-of-the-box wireless …

Horizon Personal Communications Inc. launched its personal communications services network in seven basic trading areas in Ohio and West Virginia, under an affiliate agreement with Sprint Spectrum L.P. Horizon, which …

CUPERTINO, Calif.-DSP Communications Inc. introduced a single-chip Personal Digital Cellular solution, called PDChip d5311E. The PDC chip’s architecture is based on Texas Instruments Inc.’s TMS320C54x DSP core, which combines a …

Lucent Technologies Inc.’s Microelectronics Group introduced a new platform for Global System for Mobile communications handsets. The platform, which is slightly larger than a business card, can provide standby times …

Information Storage Devices Inc., San Jose, Calif., introduced a single-chip, fully integrated voice storage solution designed for digital cellular handsets. The ISD5008 eliminates external analog circuitry, such as automatic gain …

The mere idea it may one day be possible to connect computers, mobile phones and other electronic devices to share voice and data transmissions without the need for cables has …

NEW YORK-Nickel cadmium batteries, long the mainstay of rechargeable power sources for wireless phones, are fading fast into handset history. Today, nickel metal hydride batteries are emerging at the top …

Motorola Inc.’s ReFLEX chipset and software solution first announced a month ago is available for purchase. The company also released more details about the product. The chipset includes a ReFLEX …

Frustrated by the lack of cooperation in Europe over convergence of third-generation technology, some U.S. cdmaOne operators have vowed to push ahead aggressively with cdma2000 technology. “Negotiations have gone on …

The International Telecommunication Union has yet to decide on the air interface for third-generation mobile phone technology, but many vendors are pushing ahead anyway with GSM-based wideband CDMA technology. The …

IBM Corp.’s Microelectronics Division last week introduced its first standard, high-volume chip based on the company’s silicon germanium manufacturing process. The company said the new standard chips can be used …

Paging carriers looking to provide airtime for telemetry and off-the-hip paging applications received a big boost when Motorola Inc. introduced its first-generation ReFLEX chipset solution. The chipset includes a ReFLEX …

For months now, my buddy Mike Houghton and the North American GSM Alliance have been scratching their heads trying to figure out how Qualcomm, Lucent and the CDMA crowd have …

WASHINGTON-Pekka Tarjanne, outgoing secretary general of the International Telecommunication Union, predicted last week a family of third-generation wireless standards will emerge by year’s end and that family will include a …

HEWLETT PACKARD A complete test solution for installing and maintaining radio-frequency infrastructure systems for Cellular Digital Packet Data and mobile data base station equipment was introduced by Hewlett-Packard Co. at …

SAN DIEGO-Qualcomm Inc. partnered with Yokogawa Digital Computer Corp. for the Japanese company to develop a diagnostics solution for Qualcomm’s fifth-generation MSM3000 Interim Standard 95-B baseband modem chipset. YDC plans …

SAN JOSE, Calif.-U.S. chip manufacturers endorsed a compromise legislative plan regarding Year 2000 disclosure issues that provides liability protection to encourage businesses to share problem-solving information about Y2K problems and …

NEW YORK-When it comes to smart cards, potential consumer demand is the proverbial tail wagging the dog of available supply, according to Avi Zahavi, chairman of the Smart Card Forum’s …