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ATLANTA-RF Micro Devices Inc. released its family of high-power, high-efficiency linear power amplifier modules for CDMA applications at this week’s CTIA Wireless 2004 show.
The RF3163, RF3164 and RF3165 PA modules are based on the company’s Lead Frame Module packaging technology, which, according to RFMD, reduces component count, product size and total cost. The modules cost $1.65 each and come in quantities of 10,000 units.
