PHOENIX-Motorola Inc.’s Semiconductor Products Sector announced it signed a memorandum of understanding with the Institute for Semiconductor Physics of Frankfurt, Germany, to jointly develop a new wireless platform based on their respective technologies.
Under the agreement, the two will combine Motorola’s CMOS semiconductor technology with IHP’s silicon germanium carbon process to create a .18/.25 micron wireless platform. According to the companies, the result will be a higher-performing, lower-cost process with the potential for system-on-chip solutions.
